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February 2014 • The PCB Design Magazine 63 e Intercept, Moss Bay EDA Launch Low-cost EMC Solution eMSAT now has several options for user flows from any layout software environment by utilizing in- tercept's numerous database translators. eMSAT customers can use a DSn file output to analyze a layout for eMC or Si errors. Pantheon reads the error file from eMSAT, then displays the list of er- rors in a custom eMSAT viewer dialog for real-time viewing. f PCB CAD Segment Down Slightly in Q3 The eDA Consortium Market Statistics Service re- ports that PCB and multichip module design soft- ware revenue dropped 0.3% YOY in Q3 2013. PCB/MCM revenue totaled $152.5 million in Q3 2013. The four-quarters moving average for PCB/ MCM increased 7.6%. g EPTAC Unveils IPC Designer Certification Team "We are very excited to be working with ePTAC Corporation and the marriage of our combined reputations in the market, to support and deliver programs that advance the skills of PCB designers everywhere," noted gary Ferrari, president of FTS. h Cadence Reports Q4, Fy 2013 Financial Results "in 2013, our talented development teams deliv- ered six new innovative products, revenue grew 10%, and we completed three important acquisi- tions in the iP space," said lip-Bu Tan, president and CeO. "Our differentiated design iP portfolio led to wins at over ten top tier customers, includ- ing head-to-head wins at advanced FinFeT nodes." i Dr. Cliff Hou to keynote 51st DAC Cliff hou, Ph.D., will be a keynote presenter at the Design Automation Conference, June 1-5, 2014. he will discuss how the introduction of 10nm and 7nm processes will alter today's ecosystem while opening greater eDA and iP opportunities, and will present new system and chip designs. j IEEE Reveals "CES: What's Next" Game Results While many are touting the future as the age of machine control and robots, 75% of the top pre- dictions selected by survey participants skewed toward the desire for mind or movement control in four categories of up-and-coming technologies: Smart appliances, exoskeletons, curved screens on cellphones, and 3D printers. for the latest circuit design news— anywhere, anytime. February 2014 • The PCB Design Magazine 63

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