SMT007 Magazine

SMT-Mar2014

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72 SMT Magazine • March 2014 conclusion In this investigation, a variety of possibili- ties were created, forming the basis for a project with experts from different companies. One of the first steps was to formulate criteria neces- sary for the final solution, including: • Printability with type 6 paste, what about thinner stencil and type 7 or 8 paste • Dispensing • Copper ball quality and quantity (size) • Temperature profiling • Tempering • Combination power electronic and SMT • How many IMC are necessary • Vacuum and/or soldering with pressure • Thermal and electrical conductivity SmT references 1. Final report on Innolot, BMBF Project; Förderträger: Forschungszentrum Jülich, NMT; Förderprogramm: MaTech; Förderkennzeichen: 03N3083A; Laufzeit: 01.03.2000-28.02.2004. 2. Scheel W., Wittke K.; Nowottnick M.; In- novative Produktionsprozesse für Hochtemper- aturelektronik am Beispiel der Kfz-Elektronik; 1. Auflage; Verlag Dr. Markus A. Detert, Templin Deutschland. 3. Materialmodifikationen für geometrisch und stofflich limitierte Verbindungsstrukturen hochintegrierter Elektronikbaugruppen "LiVe"; 1. Auflage; ISBN-13: 978-3-934142-57-2; Verlag Dr. Markus A. Detert, Templin Deutschland. 4. J. Albrecht, Jörg Trodler, H. Walter; New Generation of Lead-Free Solder Spheres and Paste; ISMP 2004; 3.9.2004, Seoul, Korea. 5. Müller, NMB, Test report Nr.: 160804. 6. Klaka, Sven. Eine Niedertemperatur- Verbindungstechnik zum Aufbau von Leistung- shalbleitermodulen. 1995. ISBN 3-89588. 7. Mertens, Christian. Die Niedertempera- tur-verbindungstechnikder Leistungselektron- ik. 2004. ISBN 3-18-336521-9. 8. Silbersintern bei niedrigen Tempera- turen und Drucken mit mikroskaligen Silber- pulvern für die Aufbau- und Verbindungstech- nik. Schmitt, Wolfgang und Krebs, Thomas. München : s.n., 2010. Imaps 2010. 9. Bai, Guofeng. Low-Temperature Sinter- ing of Nanoscale Silver Paste for Semiconductor Interconnection. s.l.:Virginia Polytechnic Insti- tute and State University, Dissertation 2005. 10. Novel Silver Contact Paste Lead Free So- lution for Die Attach. Schmitt, Wolfgang. Nürn- berg : s.n. CIPS 2010. 11. Patent DE102007010242A1. 12. Schneider-Ramelow, Tutorial High Tem- perature Packaging; SMT-Hybrid 2010. Jörg Trodler is a process engineer with heraeus Materials Tech- nology gmbh & Co. Kg. he specializes in new interconnec- tion technologies and materials, especially for lead-free and high- temperature applications. feaTure aSSEmBLY maTErIaLS FOr hIGh-TEmPEraTUrE aPPLIcaTIONS continues researchers from the university of california, riv- erside and russian academy of Science have dem- onstrated a new type of holographic memory device that could provide unprecedented data storage ca- pacity and data processing capabilities in electronic devices. The device uses spin waves, a collective oscilla- tion of spins in magnetic materials, instead of the op- tical beams. Spin waves are advantageous because they are compatible with the conventional electronic devices and may operate at a much shorter wave- length than optical devices, allowing for smaller elec- tronic devices that have greater storage capacity. "The results open a new field of research, which may have tremendous impact on the development of new logic and memory devices," said lead researcher and uC riverside research professor alexander Khi - tun. a paper, "Magnonic holographic Memory," which describes the finding, has been submitted for publication in the journal applied Physics letters. an advance copy of the paper can be accessed here. Improving electronic Devices Using Holograms

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