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62 SMT Magazine • March 2014 This leads to a need for assembly materials with improved properties. As state-of-the-art for power modules' pre- forms and solder paste are based on eutectic tin/ silver (SnAg3.5) or tin/silver/copper (SAC) with 3 or 4% silver, the eutectic SnAg3.5 alloy has worked up to 125°C for years. For temperature above 125°C, these alternatives can be used: • Special alloys for soft soldering (e.g., HT1) • Sinter paste/Sinter adhesive • Diffusion soldering (e.g., HotPowCon [HPC]) feaTure aSSEmBLY maTErIaLS FOr hIGh-TEmPEraTUrE aPPLIcaTIONS continues figure 1: assembly of a power module. Table 1: Table of soft solder alloy for the electronics.