Issue link: https://iconnect007.uberflip.com/i/270052
70 SMT Magazine • March 2014 Figure 13: igbT on DCb with SnCu solder paste (type 6) produced with a 20 μm stencil. figure 15: Transformation and structure of this project. Figure 14: igbT on DCb with SnCu solder paste (type 6) and Cu powder produced with a 20 μm stencil. feaTure aSSEmBLY maTErIaLS FOr hIGh-TEmPEraTUrE aPPLIcaTIONS continues