SMT007 Magazine

SMT-Mar2014

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70 SMT Magazine • March 2014 Figure 13: igbT on DCb with SnCu solder paste (type 6) produced with a 20 μm stencil. figure 15: Transformation and structure of this project. Figure 14: igbT on DCb with SnCu solder paste (type 6) and Cu powder produced with a 20 μm stencil. feaTure aSSEmBLY maTErIaLS FOr hIGh-TEmPEraTUrE aPPLIcaTIONS continues

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