Issue link: https://iconnect007.uberflip.com/i/271756
4 The PCB Magazine • March 2014 12 22 38 56 Thermally Conductive Substrates & Thermal Management by Ian Mayoh The Application of Spherical Bend Testing to Predict Safe Working Manufacturing Process Strains by John McMahon, P.Eng and Brian Gray, P.Eng Behavior of Materials in the Manufacturing Environment by Hardeep Heer Make The Most of High-Frequency Laminates with Resistive Foil by John Coonrod Key Factors Influencing Laminate Material Selection for Today's PCBs by Steve Iketani and Brian Nelson Ultra-flat and Almost No Profile ED-Copper Foils for High-Speed Digital PCBs by Julie Mouzon, Jérôme Petry and Laurence Vast Developments in Glass Yarns and Fabric Construction by Alun Morgan Using Flex in High-Speed Applications by Glenn Oliver m a r c h F e a t u r e d c o n t e n t 62 68 78 90 this month, we're bringing it—a comprehen- sive look at materials, that is, from some of the industry's leading experts on materials for high operating temps, behavior of materials in the manufacturing environment, materials for rF applications, glass yarns, and more! March Material Madness!