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4 The PCB Magazine • May 2014 12 Graphite-based Direct Metallization for Complex Interconnects by Michael Carano Copper Filling of Blind Microvias and Through-Holes Using Reverse-Pulse Plating by Henning Hübner, Ramona S. Mertens, and Dirk Rüß The Effects of Low-Frequency Ultrasound on Catalysed Electroless Copper Plating by A. J. Cobley, B. Abbas, A. Hussain, and B. Mkhlef m a y F e a t u r e d c o n t e n t 24 36 experts from omG, atotech and coventry university lend their expertise this month, with features addressing a range of plating & etching issues, including direct metalliza- tion for Ic designs, and more. Plating & Etching

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