SMT007 Magazine

SMT-June2014

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96 SMT Magazine • June 2014 a "PeRM Council Pb-free Research Priorities" Released by IPC ipC's perM Council has released a white paper identifying priority research areas regarding the impact and risks associated with the implementa- tion of lead-free materials in electronics. The re- search areas include tin whisker failure modes and risk mitigation, complex systems logistics, and lead-free interconnections. b IPC APeX eXPO Panel Discussions: Don't Miss Them! exploring timely issues and cutting edge technolo- gy, these panels offer lively debate and unique per- spectives on topics ranging from data file transfer formats to breakthroughs in flex circuitry—and so much more. In a small group setting, industry ex- perts weigh in with their thoughts on business and technical issues that you won't see anywhere else. c SMTA Publishes electronic Assembly Handbook Chapter topics include soldering and materials, printed wiring boards, components, paste-print stencil, component placement, assembly line de- sign and optimization, solder reflow, wave sol- dering, dispensing, and inspection and test. each chapter outlines the fundamental attributes of critical assembly processes with full-color images and diagrams to illustrate real-world applications. d IPC APeX eXPO 2014 Concludes Successfully In addition to experiencing a 14% increase in registrations to the technical programs and near- record participation levels in Standards develop- ment Committee meetings, IpC apeX eXpo host- ed a sold out exhibition: four hundred forty-three exhibitors encompassing 137,700 net square feet—the largest exhibition in five years. Top Ten news Highlights from SMTonline this Month 96 SMT Magazine • June 2014

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