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Systems Technology UTS-xs – The Universal Transport System for Horizontal Processing of Flex and Ultra-Thin Material Electronics Capabilities of UTS-xs Panel Thickness* (minimum) 25 µm + 2x3 µm Cu 40 µm + 2x1 µm Cu 60 µm bare Laminate Panel Width 70 mm - 650 mm w/o plater 355 mm - 630 mm with plater Panel Length 360 mm - 610 mm with Plater 360 mm - 810 mm w/o Plater Rinse with UTS-xs features Flexible PCB The UTS-xs will support all your horizontal des- mearing, PTH plating and bonding applications. Our System is the 1st equipment available in the industry today, for horizontal processing of flex and ultra-thin sheet material down to 25 μm + 2 x 3 μm copper clad without additional frame for transport. This offers the ability to process different board thicknesses without production interruption, featuring automatic solution level management and directed solution flow. Features and Benefits ▪ Automatic level management: Solution flow into the working tray and return flow are automatically balanced to keep the level in the tray as set. ▪ State-of-the-art fluid delivery devices are designed for optimum solution exchange in through holes and BMVs. ▪ Fluid supply easily adjustable to the process needs via VCS (Visualization and Control System): each pair of flooding element could be controlled separately due to pressure measurement and separate pump. ▪ Impact less CGA (Center Gap Adjustment): controlled by light barriers and a respective control software - allowing nearly impact less positioning of the panel. Cu12 InPulse 2 with UTS-xs transport system *Values may deviate in case of specific panel specifications

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