PCB007 Magazine

PCB-July2014

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July 2014 • The PCB Magazine 31 References 1. WECC for Market data, 2013 and Michael Gasch, of Data4PCB publication. 2. Thomas Hofmann of Hofmann Leiterplat- ten GmbH, Regensburg, Germany. Presentation on ECWC12 in Taiwan Paper No: EU173 and paper at the ECWC13 in Nuremberg, May 2014. Presentations on congresses 2006–2012. Publi- cations in any professional journals (e.g., PLUS, PCB007); DE-Patent: DE19627543; DE-Patent: DE102005017838; EP-Patent: EP12007766; Trademark: DE30201301845; Trademark: DE39607556. 3. Siemens AG, Karlsruhe, Germany. 4. IC Insights 3/2013. 5. PWB flex Circuit Connection USA/WuS, Taiwan 2002. 6. iPhone 5, Apple Computer, 2013. 7. Johannes Stahr of AT&S, Leoben, Austria 2012. 8. ACB, Belgium April 2012. 9. Alun Morgan of ISOLA. 10. "Value in Use" to define optimum tech- nology / Cost option. Michael Wienhold. 12. ISBN: 92-826-3445-0, Reference No.: RX- 72-91-568-EN-C, Publication year: 1992. 13. The European Union (EU) has more than 500 million inhabitants, who represent a large industrial and consumer market. The EU today has the third largest population after China and India. Figure 14: For large quantities, a not-in-kind technologies may offer technical as well as cost benefits. in addition dimensional changes and miniaturisation are also key drivers for alternative technologies [10] . Michael Weinhold is the technical director of the european institute of Printed circuits. he may be reached at mkweinhold@t-online.de. DEvICE EMBEDDING IN PCBS: EvOLUTION OR REvOLUTION? continues

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