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Page 32 of 92

The latest in gap filling at Taiyo THP ® -100DX1 (GF) Thermal Curable Gap Filling Dielectric • Used to make High Copper Inner Layers Planar • Screen Print Application with Flame Resistant Properties • High Tg (160°C) and Low CTE (32/115 ppm) • Very Low Shrinkage and Ease of Planarization • No Chemical Attack through Desmear • Excellent Adhesion Between Layers • Compatible with Lead-Free Processing • Halogen Free and RoHS Compliant Phone [775] 885-9959 • www.taiyo-america.com • info@taiyo-america.com Courtesy of Micro PCB TAIYO-US-PCB007-JUNE2013_v2.indd 1 6/26/13 2:06 PM

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