The latest in gap filling at Taiyo
THP
®
-100DX1 (GF)
Thermal Curable Gap Filling Dielectric
•
Used to make High Copper Inner Layers Planar
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Screen Print Application with Flame Resistant Properties
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High Tg (160°C) and Low CTE (32/115 ppm)
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Very Low Shrinkage and Ease of Planarization
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No Chemical Attack through Desmear
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Excellent Adhesion Between Layers
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Compatible with Lead-Free Processing
•
Halogen Free and RoHS Compliant
Phone [775] 885-9959 • www.taiyo-america.com • info@taiyo-america.com
Courtesy of Micro PCB
TAIYO-US-PCB007-JUNE2013_v2.indd 1 6/26/13 2:06 PM
