SMT Magazine

SMT-Aug2014

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Indium10.1 Solder Paste • Superior QFN and BGA voiding resistance • Eliminates head-in-pillow defects • Provides excellent graping resistance • Long-lasting oxygen barrier during reflow • Consistent high print transfer efficiency Learn more: http://indium.us/D1148 A S I A • C H I N A • E U R O P E • U S A www.indium.com askus@indium.com ©2014 Indium Corporation Industry Leading Paste Indium10.1 >50% Less Voiding!

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