Issue link: https://iconnect007.uberflip.com/i/359006
Final Finishing PallaBond – Direct pure EP and EPAG for Soldering, Au- and Cu-Wire Bonding Electronics Features and Benefit ▪ Environmentally friendly process ▪ Finish thickness < 0.3 μm allowing very fin lines and spaces (e.g. L/S 10 µm). ▪ Very good wire bonding capability with Al, Au, Ag, Cu and Cu-Pd wires ▪ Suitable for eutectic and Pb free soldering ▪ Suitable for high frequency applications ▪ Suitable for key press application ▪ Good solder joint reliability ▪ Low energy and water consumption com- pared to ENIG, ENEPIG and immersion Sn ▪ Excellent compatibility with basematerials and soldermasks because of very mild process conditions Recommended Thickness: Cu wire 20 µm (Heraeus Maxsoft copper) on pure EP finish view from top Cu wire Cleaner PallaBond CLN PallaBond Process Pre Dip PallaBond PREDIP Microetch PallaBond ME Activator PallaBond ACT E'less Pd Bath PallaBond PD Optional for EPAG: E'Less AU PallaBond AU PallaBond – Fine Line Capability 30 µm 15.9 µm 30 µm 29.6 µm 30 µm 15.5 µm PallaBond ENIG ENEPIG 0.15 µm Pd Optional 0.1 µm Au 7 µm Ni 0.10 µm Au 7 µm Ni 0.15 µm Pd 0.10 µm Au [µm] 0.1 - Au Pd [µm] Ni [µm] 0.1 - PallaBond EPAG 0.15 - PallaBond EP Atotech Main Offic · P.O. Box 21 07 80 · 10507 Berlin · Germany Tel.: +49 30 - 349 85-0 · Fax:+49 30 - 349 85-777 · www.atotech.com