Design007 Magazine

PCBD-Aug2014

Issue link: http://iconnect007.uberflip.com/i/362552

Contents of this Issue

Navigation

Page 19 of 60

20 The PCB Design Magazine • August 2014 RF Capacitor Material for Use in PCBs feature capacitor will be presented in terms of etching uniformity to minimize the variation of the ca- pacitor electrode areas. I. Introduction Organic-based dielectric materials have been explored for the use either in discrete passive components on the PCB or in being embedded within the packaging substrate as part of RF/mi- crowave circuits [1–4] . Using ceramic-functional- particles (fillers), filled polymer composite ma- terial is merely a convenient and inexpensive way (to compete with ceramic chip capacitors) achieving low ESR (equivalent series resistance), high SRF (self-resonant frequency) for RF ca- pacitor application that can support frequen- cies well above 1GHz. Besides, embedding fill- ers into the polymer enhances properties of di- electric materials (by optimizing filler chemistry and its distribution in the polymer matrix) such as temperature stability of capacitance for high- precision RF circuit and dielectric strength (the maximum DC electric field strength applied across the dielectrics in RF capacitor) for a high- Abstract A novel ceramic-functional-particle-filled polymer composite material has been devel- oped for use in discrete elements on the PCB or embedded within the packaging substrate for high-frequency circuit applications. This material provides the desired properties such as low loss at high frequencies (about 0.002 or less up to 10GHz) and high dielectric strength, among other improved properties. The electri- cal properties were influenced significantly by the ceramic-functional-particle (type and par- ticle size/distribution in the polymer matrix). Their contributions to the electric strength and temperature stability of capacitance (an impor- tant material issue for practical device applica- tion) will be discussed. In addition, capacitance tolerance for manufacturing an embedded RF by Jin-Hyun Hwang, John Andresakis, Ethan Feinberg, Bob Carter, yuji Kageyama, and Fujio Kuwako OAk-MiTsui TeChnOlOgies

Articles in this issue

Archives of this issue

view archives of Design007 Magazine - PCBD-Aug2014