Issue link: https://iconnect007.uberflip.com/i/378511
58 The PCB Design Magazine • September 2014 by Real Time with... NEPCON South China Scientists have developed what they believe is the thinnest-possible semiconductor, a new class of nanoscale materials made in sheets only three atoms thick. The university of Washington researchers have demonstrated that two of these single- layer semiconductor materials can be connected in an atomically seamless fashion known as a heterojunction. This result could be the basis for next-generation flexible and transparent computing, better light-emitting diodes, or leDs, and solar technologies. The researchers discovered that two flat semiconductor materials can be connected edge-to-edge with crystalline perfection. They worked with two single-layer, or monolayer, materials--molybdenum disel- enide and tungsten diselenide--that have very similar structures, which was key to creating the composite two-dimensional semiconductor. Collaborators from the electron microsco- py center at the university of Warwick in eng- land found that all the atoms in both materials formed a single honeycomb lattice structure, without any distortions or discontinuities. First, they inserted a powder mixture of the two mate- rials into a chamber heated to 900 degrees Cel- sius (1,652 F). Hydrogen gas was then passed through the chamber and the evaporated atoms from one of the materials were carried toward a cooler region of the tube and deposited as sin- gle-layer crystals in the shape of triangles. After a while, evaporated at- oms from the second material then attached to the edges of the triangle to create a seam- less semiconducting hetero- junction. researchers have already demonstrated that the junction interacts with light much more strongly than the rest of the monolayer. Scientists Develop Thinnest- Possible Semiconductor realtimewith.com CliCk To View i-Connect007 Panel discussion video Altium's Ben Jordan moder- ates a multi-perspective look into file format transfer options with panelists Karel Tavernier (ucamco), Dave Wiens (Mentor Graphics) and Hemant Shah (Cadence). The Great File Format Transfer Debate Sponsored by Gardien Group