SMT007 Magazine

SMT-Oct2014

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4 SMT Magazine • October 2014 Industry researchers have been predicting the elimination of solder for years. We're not there yet, but solderless assembly development is continuing apace. In this issue, A. A. Zinn, R. M. Stoltenberg, J. Beddow, and J. Chang of Lockheed Martin discuss a new nanocopper-based sol- der-free material that can replace tin-lead and lead-free solder. And Joe Fjelstad offers an update on solder alloy-free electronics (SAFE) processes. nanocopper-based solder-Free electronic assembly material by A. A. Zinn, R. M. Stoltenberg, J. Beddow, and J. Chang assembly and the Quest for solder alloy-Free electronics (saFe) by Joe Fjelstad 12 26

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