SMT007 Magazine

SMT-Nov2014

Issue link: http://iconnect007.uberflip.com/i/408601

Contents of this Issue

Navigation

Page 11 of 80

12 SMT Magazine • November 2014 by Paul wood oK iNTerNaTioNal/MeTCal feaTure Smartphones are complex, costly devices and therefore need to be reworked correctly the first time. In order to meet the ever-growing demand for performance, the complexity of mobile de- vices has increased immensely, with 70% more packages now found inside a mobile device than just a few years ago. For instance, a 1080P HD camera with video capabilities is now available on most high-end smartphones or tablet com- puters, making their production more elaborate and expensive. The printed circuit boards for these devic- es are no longer considered disposable goods, and their bill of materials start from $150, with higher-end smartphones going up to $238, and tablets well over $300. The implementation of the surface mount devices is crucial for smartphone manufac- turers, offering increased component density and improved performance. For example, the newer style DDR memory integrated compo- nents use less power and work at twice the speed of former versions. It is not surprising that most component manufacturers now produce these surface mount devices as small as 1 mm square. Mobile products generally use an epoxy underfill to adhere components to the printed circuit board in order to meet the mechanical strength requirements of a drop test. Reworking glued components is the most difficult applica- tion in the electronics industry, and must be ad- dressed as a process. Rework Challenges foR Smartphones & Tablets

Articles in this issue

Archives of this issue

view archives of SMT007 Magazine - SMT-Nov2014