PCB007 Magazine

PCB-Nov2014

Issue link: http://iconnect007.uberflip.com/i/410144

Contents of this Issue

Navigation

Page 47 of 70

48 The PCB Magazine • November 2014 n e w s Technica uSA Installs Second Maskless DI Machine at APCT frank medina, president of technica usa, an- nounced recently that sales and activity for mask- less di equipment continues to be successful: "we are very pleased with the continued sales activity and interest in the maskless di equipment. we have installed four units in the past quarter and have had several successful evaluations during this same period." ventec Invests in FOD-avoidance Program the avoidance of foreign object contamination continues to be a fundamental objective in ven- tec europe's uK prepreg fabrication facility, and the company is proud to announce that its epoxy prepreg cutting and slitting department has been brought to the same standard of clean-room op- eration as already established for its polyimide pre- preg. Isola Group Withdraws IPO Plan isola Group ltd., a maker of laminate materials, filed with u.s. regulators on tuesday to withdraw its up to $100 million initial public offering of com- mon shares. Insulectro Signs Distribution Agreement with DuPont insulectro and duPont microcircuit materials (duPont) recently signed an agreement that allows insulectro to distribute key duPont polymer thick film paste products to u.s. custom- ers in the thin film photovoltaic, printed circuit board, smart card, and membrane touch switch markets. ESI unveils New Laser Micromachining Platform electro scientific industries, inc. has announced the µflex series multi-axis precision laser micro- machining platform, enabling new levels of price- performance in laser applications for consumer electronics, medical devices, automotive compo- nents, and many other industries. Mitsui Kinzoku Expanding Capacity of FaradFlex in Asia faradflex is used as a material for improving pow- er delivery, reducing resonances and noise, major challenges that information and communication equipment must overcome. this enables higher processing speeds and higher capacity, in multi- layer PCbs for high-speed transmission routers, servers, and supercomputers. Enthone Nets ISO/IEC 17025 Accreditation enthone ltd. (woking, uK) has received accredi- tation to the iso/ieC 17025:2005 standard. the united Kingdom accreditation service (uKas) conducted the independent, third party certifica- tion and issued tl# 8202. Rogers Debuts Laminates with Rolled Copper Foils rogers Corporation's advanced Circuit materials division, a global leader in microwave PCb materi- als, recently introduced rolled copper cladding op- tions with its ro3003, ro3035, and ro3203 low dielectric constant laminate materials. Atotech Launches CupraEtch SR Cupraetch sr is one of the company's surface pretreatment products, specifically developed to maximize the adhesion of dry and liquid solder- masks and photoresists. Fuji America, FlexLink Sign Partnership Agreement fuji america Corporation and flexlink systems, inc. recently signed a north american agreement to bring board handling equipment and conveyor systems by flexlink to fuji's existing product offer, providing turnkey solutions to the PCb industry. PCB007 Supplier/New Product News Highlights 48 The PCB Magazine • November 2014

Articles in this issue

Links on this page

Archives of this issue

view archives of PCB007 Magazine - PCB-Nov2014