48 The PCB Magazine • December 2014
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Orbotech Unveils Next-generation
DI Solution
orbotech ltd. announced that it will be launching
its newest direct imaging (di) system, the cutting-
edge nuvogo 800, for digital imaging of fine-line
hdi, mlb, flex, and rigid-flex applications for mass
production, at the tPca Show.
DuPont Debuts Pure Copper
Conductive Ink
duPont microcircuit materials (duPont) is intro-
ducing its first pure copper conductive ink for pho-
tonic curing, duPont™ Pe510 copper conductor.
duPont™ Pe510 is a cost-effective alternative to
silver conductor inks for a variety of possible appli-
cations and is the newest product in a suite of con-
ductive ink materials specifically tailored for use in
certain types of antenna, membrane touch switch
(mtS), radio-frequency identification (rFid), and
consumer electronic applications.
ESI Unveils New Laser Micromachining
Platform
electro Scientific industries, inc. has announced
the µFlex Series multi-axis precision laser micro-
machining platform, enabling new levels of price-
performance in laser applications for consumer
electronics, medical devices, automotive compo-
nents, and many other industries.
MacDermid Electronics Solutions
Launches M-Speed
the company has announced the release of m-
Speed, a complete chemical process supporting
fabrication of high-frequency Pcbs. this uniquely-
formulated process provides low-profile innerlayer
copper while delivering reliably strong adhesion to
all high-speed dielectrics.
Technica USA Installs Second Maskless
DI Machine at APCT
"We are very pleased with the continued sales ac-
tivity and interest in the maskless di equipment.
We have installed four units in the past quarter and
have had several successful evaluations during this
same period," said Frank medina, president.
LPkF: Renewed Growth Expected in 2015
after having experienced average annual growth
of 23% over the past five years, in october 2014
the tecdax company had to adjust its annual
profit forecast downward for the first time in six
years and prepare its investors for lower revenue
and earnings in 2014.
Molex Develops 3D Moulded Technology
this innovative 3d technology combines advanced
mid technology with ldS antenna expertise to de-
liver integrated fine-pitch 3d circuitry in a single
molded package suitable for high-density medical
devices meeting stringent medical grade guidelines.
Orbotech Defies Market Weakness;
Posts Solid Q3 Growth
commenting on the results, asher levy, ceo, said,
"the overall business environment was solid dur-
ing the quarter, notwithstanding some weakness
in the Pcb industry. For orbotech, the quarter was
marked by a strong momentum of innovation."
revenues for the first nine months of 2014 totaled
$385.3 million, compared to $317.8 million re-
corded in the first nine months of 2013.
Rogers Printed Circuit Materials Sets
Q3 Sales Record
bruce d. hoechner, president and ceo, comment-
ed, "We are very pleased to report that in the third
quarter, we set another all-time quarterly revenue
record and posted our seventh consecutive quar-
ter of year-over-year revenue growth. all three of
our business segments contributed solid results
and, overall, we saw strong gains in both gross
margin and operating margin resulting in excel-
lent earnings."
Isola Completes Testing of Laminate
Materials
the company has announced the successful com-
pletion of class 2 testing of laminate materials for
conductive anodic Filament (caF) resistance. the
laminate materials were constructed with glass
fabric woven at isola Fabrics, a subsidiary of isola
group S.à r.l.
PCB007 Supplier/New Product
News Highlights
48 The PCB Magazine • December 2014
