PCB007 Magazine

PCB-Mar2015

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6 The PCB Magazine • March 2015 VIDEO InTErVIEwS Ventec's Commitment to FOD Elimination Sets the Trend Sanjay Hupikar and Dan Feinberg Discuss IPC APEX EXPO 2015 ShOrTS Predicting Metamaterial Nonlinear Optical Properties EIPC Honors Starkey and Ling as Valued Industry Fellows Making High-quality Fiber-based Electronic Devices ExTraS Events Calendar Advertisers Index & Masthead ShOw rEVIEw 2015 IPC APEX EXPO Show Review COLuMnS More Pesky Soldermask Problems: Plugged Via Leading to Skip Plating by Michael Carano Best Practices 101, Part 5: Process Capability by Steve Williams Optical Interconnects by Karl Dietz nEwS hIGhLIGhTS Mil/Aero007 Market Supplier/New Product Top Ten PCB007 News Highlights Contents 54 72 76 82 52 70 80 86 25 43 19 51 75 88 89 march 2015 Volume 5 Number 3 the defiNitiVe iNteractiVe magaziNe dedicated to the global Pcb iNdustry thepcbmagazine.com

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