Issue link: https://iconnect007.uberflip.com/i/488725
4 SMT Magazine • April 2015 This month, experts from Indium, Inventec, Vitronics, Micronic Mydata and BEST Inc. weigh in on soldering technologies and solutions, from reliability issues to position accuracy machines and alternatives to polyimide tape, and more! reflow profiling on the Electrical reliability of No-Clean Solder paste Flux residues by Eric Bastow reliability assessment of No-Clean and Water-soluble Solder pastes, part ii by Emmanuelle Guéné and Steven Teh position accuracy Machines for Selective Soldering of Fine-pitch Components by Gerjan Diepstraten Jetting Strategies for mBGas: a Question of Give and Take by Gustaf Mårtensson and Thomas Kurian Debunking the Myth: polyimide Tape is Not the Only answer During rework by Bob Wettermann 8 26 42 56 66 Featured Content April 2015 Soldering technologieS m a g a z i n E