SMT007 Magazine

SMT-Apr2015

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April 2015 • SMT Magazine 97 a d v E r t i s E r i n d E x PuBlISHER: Barry MaTTiES SAlES MAnAGER: BarB HOCKaDay (916) 608-0660; MARKETInG SERVICES: TOBEy MarSiCOvETErE (916) 266-9160; tobey@iconnect007.com EDITORIAL: Managing ediTor: liSa luCKE (209) 304-4011; lisa@iconnect007.com, Managing ediTor: aNDy SHauGHNESSy (770) 315-9901; TecHnical ediTor: pETE STarKEy +44 (0) 1455 293333; SMT® (Surface Mount Technology) is published by BR Publishing, Inc., Po Box 50, Seaside, oR 97138 ©2015 br publishing, inc. does not assume and hereby disclaims any liability to any person for loss or damage caused by errors or omissions in the material contained within this publication, regardless of whether such errors or omissions are caused accidentally, from negligence or any other cause. April 2015, Volume 30, number 4 • SMT© (Surface Mount Technology©) is published monthly, by BR Publishing, Inc. Coming Soon to SMT Magazine: may: paste printing & Component placement junE: Test & inspection july: Supply Chain Management advancements in Thermal Mgmt.. 73 AIM Solder........................... 57 blackfox................................ 41 candor industries................. 51 david dibble........................ 75 dymax................................... 9 eagle electronics................... 47 easybraid.............................. 53 ee Technologies.................... 61 electronic interconnect......... 15 goepel............................. 3, 55 Heraeus................................ 49 Hunter Technology............... 83 imagineering.......................... 7 ipc....................................... 71 Manncorp.............................. 5 Mentor................................. 87 Miraco inc............................ 31 nepcon................................ 65 nordson ASYMTEK............... 27 p Kay Metal.......................... 43 The pcb list..................... 2, 93 portus.................................. 81 rehm.................................... 19 Saki...................................... 13 SMTA............................. 77, 89 Technica............................... 67 Transition automation.......... 35 uS Circuit............................. 23 EDITORIAL ADVISORY BOARD: Bill COlEMaN, pH.D., Photo Stencil Happy HOlDEN, IPC and SMTA CraiG HuNTEr, vishay Dr. JENNiE S. HWaNG, H-Technology group MiCHaEl KONraD, aqueous Technologies GraHaM NaiSBiTT, Gen3 Systems & SMART Group ray praSaD, ray prasad consultancy group STEvE puDlES, ipc S. MaNiaN raMKuMar, pH.D., rochester institute of Technology rOBErT rOWlaND, RadiSys Corporation DONGKai SHaNGGuaN, pH.D., national center for advanced packaging, china vErN SOlBErG, independent Technical consultant Gary TaNEl, electronics alliance TODD SCHEErEr, ZESTRon America MAGAZINE PRODUCTION CREW: producTion Manager: SHElly STEiN MagaZine layouT: rON MEOGrOSSi AD DESIGn: SHElly STEiN, MiKE raDOGNa innovaTive TecHnology: BrySON MaTTiES cover: SHElly STEiN

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