Issue link: https://iconnect007.uberflip.com/i/488725
24 SMT Magazine • April 2015 ElECTriCal rEliaBiliTy OF NO-ClEaN SOlDEr paSTE Flux rESiDuES continues FeAture figure 26: Halogen-containing solder paste, 255°c peak temperature soak profile (run 2). Figure 28: Halogen-free normalized average SIR values. figure 27: controls (run 2). ment in SIR performance. The soak times in this study ranged from only 31 to 40 seconds (time between 200°C and 215°C). This may be good news for applications involving thermally sensitive components and/or substrate materi - als, or in applications where achieving a higher peak temperature may be challenging due to thermal density. The effect of flux chemistry—