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PCB-Apr2015

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April 2015 • The PCB Magazine 75 5 FlexTech Honors Flex Electronics Firms FlexTech alliance awarded Thin Film electronics, Vitex Systems and Pacific northwest national lab- oratories (Pnnl), and California Polytechnic Insti- tute's Graphic Communication Department with the 7th annual FlexI awards for Innovation, r&D, and leadership in education awards, respectively. 6 Schmoll Keeping an Eye on the Future—and on LDI In this interview, Thomas kunz, who has been at the helm of Schmoll Maschinen as president since 1993, discusses the company's lengthy his- tory in mechanical engineering (more than 70 years!), current global scope, and what he sees as a steady progression in directions that make the most sense to customers, which include laser di- rect imaging. 7 IPC Volunteers Recognized at APEx IPC presented Committee leadership, Distinguished Committee Service and Special recognition awards at IPC aPex exPo® at the San Diego Convention Center in February. The awards were presented to individuals who made significant contributions to IPC and the industry by lending their time and ex- pertise through IPC committee service. 8 IPC Opens Latest Statistical Programs IPC's global statistical programs for the laminate, solder, process consumables and assembly equip- ment industries are now open to new participants for 2015. The deadline for IPC members to sign up is april 15. Participation is free to IPC-member companies as a benefit of membership. 9 Shennan Circuit Gets Top Supplier Award "Having a network of strong-performing suppli- ers that share our commitment to delivering ex- ceptional quality and cost-effective solutions is essential to meeting our customers' needs," said wayne Flory, vice president, material & supply for rockwell Collins. "Shennan has been a strong- performing supplier since we started working with the company nearly ten years ago." J HDI Leads Rigid PCB Growth in 2014 High-density interconnect was still a main engine of growth in rigid PCB field in 2014, and is ex- pected to maintain the momentum in 2015. as mobile phone screens become larger, PCBs for mobile phones have to react accordingly. To en- sure light weight and thinness of mobile phones, the demand for more advanced anylayer HDI in- creases tremendously. For the latest PCB news and information, visit: PCB007.com April 2015 • The PCB Magazine 75

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