April 2015 • The PCB Magazine 75
5
FlexTech Honors Flex
Electronics Firms
FlexTech alliance awarded Thin Film electronics,
Vitex Systems and Pacific northwest national lab-
oratories (Pnnl), and California Polytechnic Insti-
tute's Graphic Communication Department with
the 7th annual FlexI awards for Innovation, r&D,
and leadership in education awards, respectively.
6
Schmoll Keeping an Eye
on the Future—and on LDI
In this interview, Thomas kunz, who has been
at the helm of Schmoll Maschinen as president
since 1993, discusses the company's lengthy his-
tory in mechanical engineering (more than 70
years!), current global scope, and what he sees as
a steady progression in directions that make the
most sense to customers, which include laser di-
rect imaging.
7
IPC Volunteers Recognized
at APEx
IPC presented Committee leadership, Distinguished
Committee Service and Special recognition awards
at IPC aPex exPo® at the San Diego Convention
Center in February. The awards were presented to
individuals who made significant contributions to
IPC and the industry by lending their time and ex-
pertise through IPC committee service.
8
IPC Opens Latest
Statistical Programs
IPC's global statistical programs for the laminate,
solder, process consumables and assembly equip-
ment industries are now open to new participants
for 2015. The deadline for IPC members to sign
up is april 15. Participation is free to IPC-member
companies as a benefit of membership.
9
Shennan Circuit Gets
Top Supplier Award
"Having a network of strong-performing suppli-
ers that share our commitment to delivering ex-
ceptional quality and cost-effective solutions is
essential to meeting our customers' needs," said
wayne Flory, vice president, material & supply for
rockwell Collins. "Shennan has been a strong-
performing supplier since we started working with
the company nearly ten years ago."
J
HDI Leads Rigid PCB
Growth in 2014
High-density interconnect was still a main engine
of growth in rigid PCB field in 2014, and is ex-
pected to maintain the momentum in 2015. as
mobile phone screens become larger, PCBs for
mobile phones have to react accordingly. To en-
sure light weight and thinness of mobile phones,
the demand for more advanced anylayer HDI in-
creases tremendously.
For the latest PCB news and
information, visit: PCB007.com
April 2015 • The PCB Magazine 75
