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46 SMT Magazine • May 2015 stencils to create a standardized way of compar- ing results. This standardization makes it pos- sible to: • Perform capability investigation • Optimize process parameters • Evaluate new materials and consumables • Perform efficient troubleshooting • Pursue status-based maintenance It also ensures repeatability and accuracy of the measurement equipment and makes it pos- sible to survey the optimized process stability over time and environmental changes. SmT IIV. acknowledgement The authors would like to thank the follow- ing people that have contributed to the devel- opment and test of the methods used in this paper and paper review: 1. Ericsson Katrineholm: Peter Sonevang, Leif Karlsson, Roger Zwosta, Staffan Bengtsson, Randy Le. 2. Ericsson Kumla: Leena Korhonen, Kalevi Lehikoinen. 3. Ericsson Kista: Benny Gustafson, Anne- Kathrine Knoph. 4. MTEK Consulting: Mattias Andersson. SOLDER PaSTE PRINTING: QUaLITy aSSURaNCE mETHODOLOGy continues figure 16: amount of solder paste misprints when comparing two different stencil manufacturing methods. figure 17: Workflow for implementing verification in a production environment. lars bruno is a product engineer at ericsson. Tord Johnson is the coo of MTeK consulting ab. Feature