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4 The PCB Magazine • May 2015 8 Optimization of Acid Copper Electrodeposition Processes for High-Throwing Power DC Plating by Michael Carano Electroplating Through-Holes with Different Geometry: A Novel and High-Productivity Process by Elie Najjar, Leon Barstad, Jayaraju Nagarajan, Marc Lin, Maria Rzeznik and Mark Lefebvre ENEPIG: The Plating Process by George Milad May Featured content 22 44 This month, features from Michael Carano (RBP Chemical Technology), a team from Dow Chemicals Company, and George Milad (Uyemura) share their perspectives on plating and etching issues. Plating & Etching

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