SMT007 Magazine

SMT-June2015

Issue link: http://iconnect007.uberflip.com/i/520182

Contents of this Issue

Navigation

Page 15 of 74

16 SMT Magazine • June 2015 Feature HIGH-DenSITy InTeRCOnneCT AnD eMBeDDeD BOARD TeST continues combinational ICT and EBT provides excellent test coverage. Conclusion With new electronic functions constantly being integrated into a SoC encapsulated in a less than 0.5 mm pitch array package, the fu- ture looks bright for EBT. The SoC will become a main stream component in all consumer por- table devices extending into IoT devices. These fast and power efficient products will push higher density interconnects, burying almost all nets except for power and ground nets and creating the need for EBT. While EBT is current- ly in the early adopter stage, growing adoption and implementation of IEEE 1687 is sure to en- able EBT to cross the chasm to the early major- ity stage in a few years. SMT Mark lau is a product manager with Keysight Technologies inc., formerly Agilent Technologies' electronic measurement business. reservations for delegate places and book- ings for table top exhibition space are already being received for the SMART group european conference & exhibition, to be held September 22–23 at the national physical laboratory (npl), one of the uK's leading science and research fa- cilities, in london. The conference will be held over two days with a table top exhibition, allowing delegates to see and meet many of the leading suppliers of materials, equipment and testing services in the industry. The exhibition will open each day prior to the start of the conference, during the coffee breaks and lunch. A special reception for delegates, speakers and exhibitors will be held on the first evening of the conference. Presentations planned include: • Making the Right Decisions at the Right Time in the PcB Design Process • Business opportunity in Wearable Technology • Successful Audits to iPc, AS9100 & nADcAP—What Any company Must Know • elimination of Tin Whiskers—the options • high Temperature Manufacturing: an opportunity for ceMs • laser & contact Soldering for lead-Free & high-Temperature Alloys • Selective Soldering—implementation Rationale, Board Design & Processing optimisation—A users View Prior to the conference, SMART will hold a FRee pre-conference webinar to showcase spe- cific topics and the latest developments in the industry, and to see who will be exhibiting at nPl. An early book- ing discount is available. To book space for the pre-conference webi- nar register here. Delegate places for either of the days on the conference (or both days) or to reserve your table top exhibition space please call paula on +44 (0)208 4322741, email info@smartgroup.org or visit our website www.smartgroup.org. SMART Group's 2015 European Conference

Articles in this issue

Links on this page

Archives of this issue

view archives of SMT007 Magazine - SMT-June2015