SMT007 Magazine

6 SMT Magazine • June 2015 article event Review: 6th electronic Materials and Processes for Space Workshop (eMPS-6) by Barrie Dunn column In-Circuit Pin Testing: An excellent Potential Source of Value Creation by Mitch Holtzer Short SMART Group's 2015 european Conference C o n t e n t s June 2015 voluMe 30 nuMber 6 www.smtmagazine.com enGineerinG SoluTionS for pcb MAnufAcTurinG 52 68 16 Video interViewS Solving Inspection Problems with True 3D in AOI, AXI and SPI Systems Open Failure Analysis Lab Assessment Service Available newS highlightS Market Supplier Mil/Aero SMT007 extraS events Calendar Advertiser Index & Masthead 48 71 38 50 66 72 74 75 m a g a z i n E

• Cover
• Featured Content — Test & Inspection
• Contents
• Feature — High-Density Interconnect and Embedded Board Test
• Short — SMART Group's 2015 European Conference
• Feature — Test Match-Partnering Specialist Boundary-Scan with ICT
• Feature — In-line Solder Penetration Testing with 3D X-ray Inspection
• Feature — Acoustic Surface Flatness of Components and Boards
• News — EIN Market Highlights
• Feature Interview — Inspection: The Last Line of Defense
• Video Interview — Solving Inspection Problems with True 3D in AOI, AXI and SPI Systems
• News — SMT007 Supplier/New Product News Highlights
• Article — Event Review: 6th Electronic Materials and Processes for Space Workshop (EMPS-6)
• News — Mil/Aero007 News Highlights
• Column — In-Circuit Pin Testing: An Excellent Potential Source of Value Creation
• Video Interview — Open Failure Analysis Lab Assessment Service Available
• Top Ten Recent Highlights from SMT007
• Events Calendar
• Advertiser Index and Masthead