72 SMT Magazine • June 2015
1
Zentech: expanding eMS
Solutions and Supporting
Innovation
Zentech ceo and president Matt Turpin sat down
with i-connect007 Publisher Barry Matties recently
for a wide-ranging discussion on the state of both
domestic and global manufacturing, and Zentech's
recent acquisition that will significantly expand the
company's capabilities. They also addressed supply
chain issues, automation, regulations, and the im
-
portance of STeM education in the u.S.
2
Solder Paste Stencil Design
for Optimal QFn yield
and Reliability
During the past 15 years, the implementation of the
QFn/BTc package has garnered a great amount
of attention due to the assembly and inspection
process challenges associated with the package.
The difference in solder application parameters be-
tween the center pad and the perimeter pads com-
plicates stencil design, and must be given special
attention to balance the dissimilar requirements.
3
nePCOn China Showcases
Latest Manufacturing
Tech in Asia
considered Asia's most influential SMT and elec-
tronics manufacturing event, nepcon china
2015 attracted over 450 leading brands from 22
countries, and showcased the latest electronics
manufacturing technologies and products across
an exhibition area of 25,000 sqm. i-connect007 is
on hand again this year with exclusive interviews
and photos from the show floor.
4
Zentech Manufacturing
Acquires Colonial Assembly
and Design
The acquisition provides tremendous synergy with
Zentech's established customer set in the DoD and
military c4iSR (command, control, computers,
communications, intelligence, surveillance, recon-
naissance) sectors while also providing enhanced
engineering, product design, circuit design, ma-
chining, over-molded cable assembly and wire
harnessing capabilities to the Zentech portfolio.
toP
ten
Recent Highlights from SMT007
72 SMT Magazine • June 2015
