SMT007 Magazine

SMT-June2015

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72 SMT Magazine • June 2015 1 Zentech: expanding eMS Solutions and Supporting Innovation Zentech ceo and president Matt Turpin sat down with i-connect007 Publisher Barry Matties recently for a wide-ranging discussion on the state of both domestic and global manufacturing, and Zentech's recent acquisition that will significantly expand the company's capabilities. They also addressed supply chain issues, automation, regulations, and the im - portance of STeM education in the u.S. 2 Solder Paste Stencil Design for Optimal QFn yield and Reliability During the past 15 years, the implementation of the QFn/BTc package has garnered a great amount of attention due to the assembly and inspection process challenges associated with the package. The difference in solder application parameters be- tween the center pad and the perimeter pads com- plicates stencil design, and must be given special attention to balance the dissimilar requirements. 3 nePCOn China Showcases Latest Manufacturing Tech in Asia considered Asia's most influential SMT and elec- tronics manufacturing event, nepcon china 2015 attracted over 450 leading brands from 22 countries, and showcased the latest electronics manufacturing technologies and products across an exhibition area of 25,000 sqm. i-connect007 is on hand again this year with exclusive interviews and photos from the show floor. 4 Zentech Manufacturing Acquires Colonial Assembly and Design The acquisition provides tremendous synergy with Zentech's established customer set in the DoD and military c4iSR (command, control, computers, communications, intelligence, surveillance, recon- naissance) sectors while also providing enhanced engineering, product design, circuit design, ma- chining, over-molded cable assembly and wire harnessing capabilities to the Zentech portfolio. toP ten Recent Highlights from SMT007 72 SMT Magazine • June 2015

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