PCB007 Magazine

PCB-June2015

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4 The PCB Magazine • June 2015 10 22 32 A High-Reliability, Stress-free Copper Deposit for FPC, Polyimide and Rigid-Flex by Jason Carver and Alvin Kucera Enabling Smart Wearable Technology: Flexible, Stretchable Interconnect by Joan K. Vrtis, Ph.D. Flexible and Stretchable Circuit Technologies for Space Applications by Maarten Cauwe, Frederick Bossuyt, Johan De Baets, and Jan Vanfleteren Flexible Circuit Materials for High-Temperature Applications by Sidney Cox Staying Current: High-Speed UV Laser Micromachining and Flex Circuit Trends by Patrick Riechel Novel High-Performance Substrate for Stretchable Electronics by Shingo Yoshioka, Tomoaki Sawada and Takatoshi Abe June Featured Content 44 52 60 This month, a comprehensive view of the scope of flex circuit technology is presented in features from OM Group, Multek, DuPont, ESI, and more. Cover photo courtesy of MC10, www.mc10inc.com Flexible, Stretchable & Wearable

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