PCB007 Magazine

PCB-June2015

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June 2015 • The PCB Magazine 63 Figure 4: Process steps for making an air gap laminate and photomicrographs of the material both before and after lamination. Figure 3: a comparison of the material properties of the new stretchable thermosetting resin and PEn. NOVEL HIGH-PERFORMANCE SUBSTRATE FOR STRETCHABLE ELECTRONICS continues FeAtuRe

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