SMT007 Magazine

Electronics Manufacturing MIDs leadfree soldering up to 240° Photovoltaics Substrates on heat sinks Power electronic Hardening of adhesives and compounds Voidfree Soldering Package on Package Semiconductor CondensoX Series Vapour Phase Soldering with vacuum CondensoX Series Vapour Phase Soldering Source: Osram Source: Audi s Visit us at SMTA International Chicago – Booth # 437 –

• Front Cover
• Featured Content — The War on Process Failure
• Contents
• Column — A Letter from the New Editor
• Feature — The War on Soldering Defects under Area Array Packages: Head-in-Pillow and Non-Wet Open
• Short — Simulations Lead to Design of Near-frictionless Material
• Feature — Declaring War on Failure in Electronics
• Feature — How Clean is Clean Enough to Achieve Reliable Electronic Hardware?
• Feature — Addressing Quality and Manufacturability Challenges of Mission-Critical Products
• Feature — Collaboration between OEM and EMS to Combat Head-on-Pillow Defects, Part 2: Warpage Acceptance Proposal
• Short — Neutrons Find "Missing" Magnetism of Plutonium
• Feature Summary — "War on Failure" in the August Issue of The PCB Magazine
• Feature — Case Study: Detecting Process Defects
• EIN Market Highlights
• Article — Reducing Risks to Employees' Health with Extraction and Filtration Technology
• MilAero007 Highlights
• Interview — Stencils: Why They Still Matter
• Column — Don't Allow Standards to Get the Better of You
• Column — Selecting a Reflow Oven, Part 1
• SMT007 Supplier/New Product Highlights
• Column — Supply Chain Risk Mitigation Applications for the Grey Market
• Top Ten Recent Highlights from SMT007
• Events Calendar
• Advertiser Index & Masthead
• Back Cover