Design007 Magazine

6 The PCB Design Magazine • August 2015 Contents artiCle Training the Next-Generation Engineer: When Does it Begin and End? by Tom O'Connor Columns Fighting the War on Failure by Andy Shaughnessy Stackup Planning, Part 3 by Barry Olney A Brief Overview of High-Frequency Laminates by John Coonrod 58 8 46 54 THe oPTiMuM MAGAzine DeDiCATeD To PCB DesiGn TM shorts Physicists Develop Ultrasensitive Nanomechanical Biosensor Protective Shells May Boost Silicon Lithium-ion Batteries highlights PCB007 MilAero007 PCBDesign007 extras Events Calendar Advertiser Index & Masthead 45 51 40 52 64 66 67 AuGusT 2015 VoluMe 4 nuMBeR 8 thepcbdesignmagazine.com 28 34

• Front Cover
• Featured Content — The War on Process Failure
• Table of Contents
• Column — Fighting the War on Failure
• Feature — Kelly Dack and Mark Thompson Unite in the War on Failure
• Feature Column — Failure Mode: Hole Wall Pullaway
• Feature — Mentor Graphics Helps Bridge Gap Between PCB and RF
• PCB007 Highlights
• Feature Column — Failure May Not Be an Option, but Sometimes It's a Reality
• Short — Physicists Develop Ultrasensitive Nanomechanical Biosensor
• Column — Stackup Planning, Part 3
• Short — Protective Shells May Boost Silicon Lithium-ion Batteries
• MilAero007 Highlights
• Column — A Brief Overview of High-Frequency Laminates
• Article — Training the Next-Generation Engineer: When Does it Begin and End?
• Top Ten Recent Highlights from PCBDesign007
• Events Calendar
• Advertiser Index & Masthead