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80 SMT Magazine • September 2015 The proposed rules relate most strongly to the geometry of a component solder termina- tion, showing the ability to self-mitigate under current industry standard design and produc- tion conditions, using three sample vehicles that varied in characteristics including over- all size, board thickness, presence or absence of ground planes, and density of component placement. smt Acknowledgment The authors would like that thank Aryn Hernandez, Richard Ho, Nicholas Adelchanow, William Vuono, Jonathan Kanner, Bill Rollins, Daniel Barry, Ron Mathis, Mark Stibitz, John Stephens, Joe Whitaker, and Ricardo Rodriguez. references 1. George E, Pecht M., "Tin Whisker Analy- sis of an Automobile Engine Control Unit," Mi- cro-Electronic Reliability, (2013). 2. Dave Pinsky, "Tin Whisker Risk Mitiga- tion at a Large Defense OEM—Past, Present, and Future," November 12, 2013, IPC 7th Inter- national Symposium on Tin Whiskers. 3. Craig Hillman, Gregg Kittlesen, and Ran- dy Schueller, DfR Solutions, A New (Better) Ap- proach to Tin Whisker Mitigation. 4. L. Panashchenko, "The Art of Appreciat- ing Metal Whiskers: A Practical Guide for Elec- tronics Professionals", IPC Tin Whisker Sympo- sium, Dallas, TX, April 2012. 5. Michael Osterman, Mitigation Strategies for Tin Whiskers, 28 August 2002. 6. GEIA-STD-0005-2, Standard for Mitigat- ing the Effects of Tin Whiskers in Aerospace and High Performance Electronic Systems, Rev. A, Draft, 5 January2011. 7. JEDEC Standard JESD213, Standard Test Method Utilizing X-Ray Fluorescence (XRF) for Table ii: Summary of sample boards designs 1 and 2 results. ArtiCle tIN WHIsKer seLF-mItIGAtION IN surFACe mOuNt COmpONeNts continues