36 SMT Magazine • December 2015
Solder Paste Stencil Design for optimal
QFn yield and reliability
over the past 15 years, the imple-
mentation of the QFn/BTC pack-
age has garnered a great amount of
attention due to the assembly and
inspection process challenges asso-
ciated with the package. The difference in solder
application parameters between the center pad
and the perimeter pads is discussed.
A review of the opportunities and
Processes for Printed electronics
in the first part of this five-part article series, Happy
Holden gives a brief background on printed elec-
tronics, as well as presents key technologies that
are being employed for pE production.
Advanced Printing for microelectronic
Packaging
The concept of dispensing a wide
range of materials in three dimen-
sions presents a potential change
in electronic packaging. This arti-
cle covers the concept of combin-
ing dispensing technologies on a
single platform to build integrated and monolithic
electronic structural circuits.
reliability Study of bottom Terminated
components
This article series discusses bottom terminated
components (bTC), and the stress and strain on
these components when it comes to solder joints.
in Part 1, the authors look at the impact of large
voids at the thermal pads of bTC components and
their impact on solder joint reliability.
How to Streamline Pcb Thermal Design
Thermal issues with a PCB design
are mostly determined during
the component selection and lay-
out phases. John Parry of Mentor
Graphics discusses how addressing
thermal issues early in pCb design,
starting at the system or enclosure level, can help
streamline the entire process.
enhancing Thermal Performance in
embedded computing for ruggedized
military and Avionics Applications
Embedded computing systems used in many mili-
tary and avionics applications are trending toward
higher heat fluxes, and as a result performance is
being hindered by thermal limitations. This article
outlines a series of passive thermal improvements
that are easily integrated into legacy systems and
can provide a 3-4x increase in dissipated power.
benefits of Soldering with Vacuum Profiles
requirements for void-free solder joints are con-
tinuously increasing in the field of electronics
manufacturing, bringing new challenges that are
evolving on a daily basis due to the relentless in-
troduction of new variants of so-called bottom-
terminated components (bTCs).
nePcon china Showcases Latest
manufacturing Tech in Asia
Considered Asia's biggest, most influ-
ential SMT and electronics manufac-
turing event, nEpCon China 2015 at-
tracted over 450 leading brands from
22 countries, who showcased the lat-
est electronics manufacturing technologies and
products across an exhibition area of 25,000 sqm.
Pad cratering Susceptibility Testing
with Acoustic emission
pad cratering is difficult to detect by monitoring
electric resistance since it initiates before an elec-
trical failure occurs. This article presents the results
of pad cratering susceptibility of laminates using
the acoustic emission method under four-point
bend and compares the aE results to the pad-sol-
der level testing results.
emI-caused eoS Sources in
Automated equipment
Electrical overstress causes damage to sensitive
components, including latent damage. a signifi-
cant source of EoS is high-frequency noise in au-
tomated manufacturing equipment. This article
analyses sources of such noise, how it affects com-
ponents and how to mitigate this problem.
36 SMT Magazine • December 2015
SmT magazine's
best of 2015
ARTiClES
