Issue link: https://iconnect007.uberflip.com/i/609948
December 2015 • SMT Magazine 55 Las Marias: how do you satisfy members' need for technical information, and in what format? Bader: The iNEMI roadmap, which is published every other year, is not only free to members but is also available to them three months prior to going on sale to non-members. The roadmap is organized into individual chapters on mar- ket segments and technology areas and can be downloaded from the iNEMI website. When iNEMI projects are completed, proj- ect teams typically report their findings to the membership as a whole through webinars and, in some cases, written reports. We also have a research webinars series that highlights research activities at universities and research institutes. Las Marias: please highlight some of inemi's suc- cess stories in the industry. Bader: iNEMI played a pivotal role in the elec- tronics industry's transition to lead-free as- sembly. The original Pb-Free Assembly Proj- ect recommended an industry-standard al- loy (Sn3.9Ag0.6Cu) to replace tin-lead solders for reflow. The team then conducted extensive testing to characterize the new materials and demonstrate reliability, plus defined modeling and data needs for Pb-free solders. Follow-on projects addressed Pb-free assembly and rework, and wave soldering. By focusing on a single Pb-free alloy, iNEMI helped industry accelerate con- vergence on standard solder formula- tions, manufacturing processes and, ul- timately, contributed to timely and cost- effective conversion to Pb-free assembly. This project moved the industry forward in knowledge and understanding of Pb- free materials and processes. iNEMI's tin whisker work evolved from its initial Pb-free efforts. A series of successful projects made significant contributions to industry's understand- ing of, and tools for managing, tin whis- kers. Project teams identified tests to pre- dict whisker formation, focused on the root causes of whiskers, and developed guidelines for minimizing risk of failure from tin whiskers in high-reliability electronic appli- cations. Several of the guidelines, specifications and recommendations developed by iNEMI's tin whisker projects were leveraged into indus- try standards: • JEDEC standard JESD22-A121, Test Method for Measuring Whisker Growth on Tin and Tin Alloy Surface Finishes (released in May 2005) • IPC/JEDEC document JP002, Current Tin Whiskers Theory and Mitigation Practices Guideline (published in March 2006) • JEDEC standard JESD201, Environmental Acceptance Requirements for Tin Whisker Susceptibility of Tin and Tin Alloy Surface Finishes (published in March 2006) • IPC/JEDEC joint publication JP002, Current Tin Whiskers Theory and Mitigation Practices Guideline iNEMI's HFR-Free program helped evalu- ate and direct the technology readiness, supply chain capability, and reliability characteristics for HFR-free printed circuit board materials and assemblies. iNEMI's efforts helped companies FeATure inTerview InemI: LeADInG THe WAy To SUcceSSFUL eLecTronIcS mAnUFAcTUrInG