PCB007 Magazine

PCB-Dec2015

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December 2015 • The PCB Magazine 113 5 Michael Carano: OSP and Selective Electroless Nickel for Mixed-Metal Finish PWBs and BGA Substrates pressure to eliminate lead in electronics assemblies is forcing fabricators and OeMs to reevaluate their surface finish and joint attachment procedures. 6 M.Cauwe, et al: Flexible and Stretchable Circuit Technologies for Space Applications Flexible and stretchable circuit technologies of- fer reduced volume and weight, increased electri- cal performance, larger design freedom and im- proved interconnect reli- ability. all of these advan- tages are appealing for space applications. 7 George Milad: ENEPIG— The Plating Process electroless nickel/ electroless palla- dium/immersion gold (enepIG) is sometimes re- ferred to as the universal finish, because of the versatility of its applications. It is a multifunctional surface finish, applicable to sol- dering and wire bonding (gold, aluminum, copper and palladium clad copper). 8 Mark Goodwin: A Well-Designed Laminate Supply Chain has to Own It! designing a supply chain for the provision of laminates and pre- pregs to the pcB fabri- cator shouldn't be that complicated, should it? the laminate is simply manufactured and then shipped...what could possibly go wrong? 9 Dan Feinberg: Automotive Technology—the Next Driving Force in Electronic Manufacturing We started with aM and then FM radios, then full stereo systems complete with tape, then disk, then SSd storage; we added speed control then GpS, and then mapping. the higher-end vehicles now have collision and ob- struction warning, back-up cameras, driver fatigue warning… and some have self-parking… But in the automotive segment, as the man once said, "You ain't seen nothing yet." J Todd Kolmodin: Splitting Hairs—The Manufacture of HDI and Substrate Test Fixtures testing of higher-density product has become ever more challenging with the advancement of chip technology. BGas, ccds and other active compo- nents have decreased in size so much that histori- cal industry accepted test methodology can no longer effectively test these newer substrates in- corporating this higher technology. December 2015 • The PCB Magazine 113

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