December 2015 • The PCB Magazine 113
5
Michael Carano: OSP and
Selective Electroless Nickel
for Mixed-Metal Finish PWBs
and BGA Substrates
pressure to eliminate lead
in electronics assemblies
is forcing fabricators and
OeMs to reevaluate their
surface finish and joint
attachment procedures.
6
M.Cauwe, et al: Flexible
and Stretchable Circuit
Technologies for Space
Applications
Flexible and stretchable
circuit technologies of-
fer reduced volume and
weight, increased electri-
cal performance, larger
design freedom and im-
proved interconnect reli-
ability. all of these advan-
tages are appealing for
space applications.
7
George Milad: ENEPIG—
The Plating Process
electroless nickel/
electroless palla-
dium/immersion
gold (enepIG)
is sometimes re-
ferred to as the
universal finish,
because of the
versatility of its
applications. It is
a multifunctional surface finish, applicable to sol-
dering and wire bonding (gold, aluminum, copper
and palladium clad copper).
8
Mark Goodwin:
A Well-Designed Laminate
Supply Chain has to Own It!
designing a supply
chain for the provision
of laminates and pre-
pregs to the pcB fabri-
cator shouldn't be that
complicated, should it?
the laminate is simply
manufactured and then
shipped...what could possibly go wrong?
9
Dan Feinberg: Automotive
Technology—the Next
Driving Force in Electronic
Manufacturing
We started with aM and
then FM radios, then full
stereo systems complete
with tape, then disk, then
SSd storage; we added
speed control then GpS,
and then mapping. the
higher-end vehicles now
have collision and ob-
struction warning, back-up cameras, driver fatigue
warning… and some have self-parking… But in
the automotive segment, as the man once said,
"You ain't seen nothing yet."
J
Todd Kolmodin: Splitting
Hairs—The Manufacture
of HDI and Substrate Test
Fixtures
testing of higher-density
product has become ever
more challenging with
the advancement of chip
technology. BGas, ccds
and other active compo-
nents have decreased in
size so much that histori-
cal industry accepted test methodology can no
longer effectively test these newer substrates in-
corporating this higher technology.
December 2015 • The PCB Magazine 113
