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PCB-Feb2016

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USA www.uyemura.com ULTIMATE ADHESION EXCEPTIONAL FLEXIBILITY Corporate Headquarters: Ontario, CA • ph: (909) 466-5635 • (800) 969-4842 Tech Center: Southington, CT • ph: (860) 793-4011 • (800) 243-3564 OPTIMUM TOPOGRAPHY MEC UIC FROM FlatBOND GT Ultimate signal integrity meets ultimate board integrity in this treatment for 25 GHz+ designs. Strong bonding with low dielectric resins. Production proven. V-Bond 7710 Exceptional inner layer adhesion, substantial cost and maintenance advantages compared with oxide alternatives; broad temperature range. Production proven. EtchBOND CZ-5480 The industry standard bearer for equipment and process flow compatibility; substantially superior to peroxide sulfuric microetchants. 2030 EtchBOND The elite adhesion promoter provides highest roughness with least material removal. Uyemura is committed to providing its customers with significant advantages in performance, cost, and maintenance, and to supporting each program with the industry's finest technical support. For details on MEC products, or to arrange test processing, contact meonta@uyemura.com, or visit us at IPC APEX, Booth 212.

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