60 The PCB Magazine • February 2016
demands for fine patterned packaging applica-
tions which require smaller than 25 mm vias,
even on multi-beam UV/CO
2
platforms.
Because of the changing needs for lasers
within a PCB facility, equipment that can
evolve as process technology advances is always
a good choice. An industrial platform that can
be tailored to the specific needs of one's pro-
cesses and outfitted for maximum production
would be the most versatile. This would include
a system that can be equipped with a variety of
laser sources, including UV, CO
2
, IR and green
at various pulse widths.
PCB
Osamu Sekine is president of
nano System Inc.
Figure 3: a) 25 mm diameter microvia on glass-filled resin; b) 25 mm/2 mm, top/bottom through-hole
via on polyamide material.
A textbook-in-progress, authored by
industry veteran Happy Holden and writ-
ten specifically for engineers and those
who want a better understanding of
engineering best practices, is available
on the pages of the I-Connect007 Daily
newsletter on the third Wednesday of
each month. (Click here to become a
subscriber.)
What started with an introductory article, 25
Essential Skills for Engineers, published in the Janu-
ary issue of The PCB Magazine, is now being de-
veloped into a long-term series that will appear
monthly over the next 18 months. In this series,
Happy will cover everything from problem solving,
DoE, and technical writing, to roadmap-
ping, economics, and business plans—
especially targeted to engineers.
From "The need for Total Quality
Control (Six Sigma and Statistical Tools),
Part 1":
"Continuous improvement must deal
not only with improving results, but more
importantly with improving capabilities to produce
better results in the future. The five major areas of
focus for capability improvement are demand gen
-
eration, supply generation, technology, operations
and people capability."
Columns may also be accessed through Happy's
columnist page by clicking here.
Coming Soon: 25 Essential Skills for Engineers, by Happy Holden
the next step: teChnology that's driving sMaller MiCrovias
