PCB007 Magazine

PCB-Mar2016

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March 2016 • The PCB Magazine 89 5 Conflict Minerals: Negotiations Begin in Europe on Proposed Legislation Informal ne- g o t i a t i o n s between the Eu Council, C o m m i s s i o n and Parlia- ment (trialogue) started on the conflict minerals dossier on February 1, 2016. The trialogue is an in- formal, closed-door process in which the Council and the Parliament try to reach to a compromise on a legislative proposal. 6 New Year, New Outlook for the Electronics Manufacturing Industry As an advocate for the elec- tronics manufacturing indus- try, my job is to educate and encourage policymakers to create a favorable legislative and regulatory environment for advanced manufacturing to grow and succeed. From that perspective, I think we should be proud of the sig- nificant progress we made in several areas in 2015. 7 In Memoriam—Dennis (Denny) J. Cantwell long-time IPC member, Dennis (Denny) J. Cantwell, 74, passed away on novem- ber 12, 2015. Denny was a very active member of the IPC Flexible Circuits Base Materials Committee until his retirement from Printed Circuits Inc. in 2009. 8 Robots, Wearables and Implanted Devices in the Age of Bionic Health If you are an electronics manufacturer and you ask your business bank- ers where their market research suggests growth will come from, they will almost certainly identify medical electronics as a key growth area. 9 How North American Fabricators Benefit from Attending HKPCA Two new Englanders in shen- zhen. It sounds like the title of a play, doesn't it? headlin- ing the bill is Peter Bigelow of IMI, who explains to me why even small American manu- facturers benefit from at- tending large Chinese shows like the hKPCA. he's joined by fellow new Englander Alex stepinski of Whelen Engineering, who discusses drill concepts and the transition to zero discharge. J Mr. Laminate Tells All: CEM-3 Reinvents Itself (Again)—or, Atari Game Boards on eBay? CEM-3 was unusual as the re- inforcement was a combina- tion of woven fiber-glass fab- ric and fiber-glass paper. The resin system was a dicy-cured epoxy resin yielding a Tg the same as FR-4 at the time, of 110–120°C range. Because it was all epoxy and all fiberglass, the properties were electrically identical to those of FR-4. For the latest PCB news and information, visit: PCB007.com

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