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MEMS TECHNOLOGY SYMPOSIUM Advancing MEMS and Sensors for Today's Exploding Demands Wednesday, May 11, 2016 San Jose, California 14th ANNUAL MEPTEC SYMPOSIUM R E G I S T E R O N L I N E T O D A Y A T W W W . M E P T E C . O R G I f you are involved in the MEMS and Sensors Industry today, or are thinking about entering it, you are in the right place at the right time. Double digit growth fueled by inertial and other sensors in smartphones, wearables, and a plethora of IOT applications have garnered the attention of many who not only see the financial rewards but also the possibilities of new and exciting markets. With this renewed growth comes a desire to reduce costs, decrease throughput times, scale to much larger volumes faster and continually in - novate with existing MEMS and sensors while preparing for the untapped broader markets. Linear technical innovations in design, processes, materials, packaging and test are enabling widespread commercialization of breakthrough MEMS products. While this is absolutely necessary to meet today's demands, will it be sufficient for the future five to ten years from now? If we believe the analysts and commercial companies predicating tens of billions of connected nodes and sensor arrays by 2020, can our industry keep up by sticking to the path we are on? MEMS sensing applications will track growth in CE, mobile, wearable's, medical, food and agriculture, environmental, energy and the catch all IOT/IOE markets. The 14th Annual MEPTEC MEMS Technology Symposium will focus on the fundamental MEMS technologies and manufac - turing techniques to address this explosive growth short to medium term but also take a peek at what's coming longer term that we all need to be aware of today. If you are involved in MEMS and Sensors design, processes, packaging, test and system integration you will not want to miss this one-day action packed and informative event. Topics to include: MEMS Design – reusability and enabling faster time to market Process Technologies – from prototypes to production better, faster cheaper Packaging – current and advanced techniques to scale more devices and functional in one package Test – design for MEMS testing and future trends Emerging Technologies – flexible, hybrid and printed MEMS and sensors Media Sponsors Your Microelectronic Package Assembly Solution for MEMS Sensors Platinum Sponsor

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