SMT007 Magazine

SMT-June2016

Issue link: http://iconnect007.uberflip.com/i/686649

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6 SMT Magazine • June 2016 H I G H L I G H T S Supply Lines MilAero007 Markets Top Ten Recent Highlights from SMT007 D E PA RT M E N T S Events Calendar Advertiser Index & Masthead S P E C I A L S E CT I O N IPC's IMPACT Washington, D.C. 2016: Who, What, Where, and Why by Patty Goldman A RT I C L E 3D Solder Joint Reconstruction on SMD based on 2D Images by Pedro M. A. Vitoriano and Tito G. Amaral CO L U M N S Solder Paste Exploration by Stephen Las Marias Pad Defined vs. Mask Defined: Which Method is Optimal? by Mitch Holtzer The Production Engineering Student as Customer by Tom Borkes To Bake or Not to Bake (in Rework)— That is the Question by Bob Wettermann Selecting a Selective Soldering System, Part 3 by Robert Voigt S H O RT S New Glue Instantly Hardens with Electric Current Engineers Discover New Gatekeeper for Light Using Solid-state Materials with Gold Nanoantennas for More Durable Solar Cells Discovery Could Energize Development of Longer-Lasting Batteries 51 82 8 22 38 98 106 12 44 93 104 More Content: 51 106 S M T M AG A Z I N E • J u n e 2 0 1 6 • Vo l . 3 1 , N o . 6 • s m t m a g a z i n e . c o m 14 20 32 110 112 113 82

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