Issue link: https://iconnect007.uberflip.com/i/686649
4 SMT Magazine • June 2016 This month, SMT Magazine discusses the challenges, best practices, and critical fac- tors to consider in solder paste printing amid tighter tolerances and smaller pitches, lines and spaces. Solder Paste Printing: Challenges and Solutions The Solder Paste Factor in Printing Interview with Mitch Holtzer Solder Paste Printing: Challenges and Best Practices Interview with Watson Tseng Solder Jet Printing: Keeping Up with the Challenges Interview with Thomas Bredin Solder Paste Dispensing: Breaking the Limits of Printing Interview with Eric Gu SPI Parameter Considerations for Tighter Tolerances Interview with Jean-Marc Peallat and Chong Choon Hee Improving the Solder Paste Printing Cycle Times Interview with Adam Sim Solder Paste Printing: A User's Perspective Interview with Joemar Apolinario, Aurelio Bantigue and Rodney Bebe The Reliability Factor in Solder Paste Printing Interview with Knoll Evangelista 10 16 26 34 46 78 94 102 June 2016 • Featured Content 78 94 10 102 M A G A Z I N E 16 34