SMT007 Magazine

SMT-July2016

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6 SMT Magazine • July 2016 S H O RT S New Generation of High-efficiency Solar Thermal Absorbers Developed New Compound Switches Between Liquid and Solid when Exposed to Light or Heat World's First 1,000-processor Chip New Nanomaterial Offers Promise in Bendable, Wearable Electronic Devices Glass Now Has Smart Potential D E PA RT M E N T S Events Calendar Advertiser Index & Masthead A RT I C L E S Material Effects of Laser Energy When Processing Circuit Board Substrates During Depaneling by Ahne Oosterhof A New Dispensing Solder Paste for Laser Soldering Technology by Hsiang-Chuan Chen, Ya-Ching Chuang, Jen-Yio Shiu, Chang-Meng Wang, and Watson Tseng How to Overcome Medical Electronics Manufacturing Challenges by Carl Lincoln CO L U M N S Improving Test and Inspection by Stephen Las Marias The Fourth Industrial Revolution (Industry 4.0): Intelligent Manufacturing by Dr. Jennie S. Hwang Industry 4.0: Making the First Move by Michael Ford The ST E M Trap by Tom Borkes Selecting a Selective Soldering System, Part 4 by Robert Voigt H I G H L I G H T S Supply Lines MilAero007 Markets Top Ten Recent Highlights from SMT007 90 102 114 8 10 30 62 84 24 54 78 120 More Content: 90 10 S M T M AG A Z I N E • J u l y 2 0 1 6 • Vo l . 3 1 , N o . 7 • s m t m a g a z i n e . c o m 15 52 61 100 113 122 123 102

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