SMT007 Magazine

Inspection Solutions AOI · AXI · SPI True 3D AOI measurement 3D sensor module 3D SPI Inspection Solder Paste www.goepel.com Automated 3D X-ray inspection

• Cover
• Featured Content — PCBA Test and Inspection
• More Content
• Column — Improving Test and Inspection
• Column — The Fourth Industrial Revolution (Industry 4.0): Intelligent Manufacturing
• Short — New Generation of High-efficiency Solar Thermal Absorbers Developed
• Feature — Divergence in Test Results Using IPC Standard SIR and Ionic Containment Measurements
• Supply Lines Highlights
• Feature Interview — Addressing New Test & Inspection Challenges
• Column — Industry 4.0: Making the First Move
• Feature — Condensation Testing: a New Approach
• Short — New Compound Switches Between Liquid and Solid States when Exposed to Light or Heat
• MilAero007 Highlights
• Feature — Perfect Placement of Connectors and Pins: 3D Measurement of Swash Circumference and Embedment Depth
• Short — World's First 1,000-processor Chip
• Column — The STEM Trap
• Feature — Package-on-Package Warpage Characteristics and Requirements
• EIN Market Highlights
• Feature — Standardizing Platforms from Characterization to Production
• Column — Selecting a Selective Soldering System, Part 4
• Article — Material Effects of Laser Energy When Processing Circuit Board Substrates During Depaneling
• Short — New Nanomaterial Offers Promise in Bendable, Wearable Electronic Devices
• Article — A New Dispensing Solder Paste for Laser Soldering Technology
• Short — Glass Now Has Smart Potential
• Article — How to Overcome Medical Electronics Manufacturing Challenges
• Top Ten Recent Highlights from SMT007
• Events Calendar
• Advertiser Index and Masthead
• Back Cover