PCB007 Magazine

PCB-Aug2016

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# 1 In North America Uyemura is UIC is proud to be the Final Finish Leader, with more new ways to help our industry innovate and compete. New from the Uyemura Labs: EPIG, a process for fine line boards that plates palladium, then gold, directly on copper. Ideal for RF/microwave applications, this nickel-free process significantly increases signal speed. EPIG is the future for shops that require maximum process flexibility. TWX-40, a hybrid gold bath for heavy deposition. Where competitor products congratulate themselves on plating 2 to 2.5 µin, TWX-40 plates 7-8 µin of gold on palladium. TWX-40 is ideal for wire bonding and other applications with heavy gold requirements. As we have since 1985, Uyemura-USA is committed to providing its customers with game-changing advantages in performance and cost, and to supporting each program with the industry's finest technical support. Corporate Headquarters: Ontario, CA • ph: (909) 466-5635 • (800) 969-4842 • www.uyemura.com Tech Center: Southington, CT • ph: (860) 793-4011 • (800) 243-3564

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