PCB007 Magazine

PCB-Nov2016

Issue link: https://iconnect007.uberflip.com/i/746712

Contents of this Issue

Navigation

Page 91 of 95

92 The PCB Magazine • November 2016 1 Weiner's World This month, I was a guest at the High Density Packaging Users Group (HDPUG) meet- ing in Nashville, Tennessee. The consortium, composed of more than 50 compa- nies (small and large) in the electronics packaging sup- ply chain, conducts projects to solve real world problems or develop data for product parameters, package/component life, and production processing. 2 ECWC14 Seeking Abstracts for 14th Electronic Circuits World Convention The 14th Elec- tronic Circuits World Conven- tion (ECWC14) will be held in KINTEX, Goyang City, South Korea from April 25– 27, 2017 along with the KPCA Show hosted by Korea Printed Circuits Association (KPCA) and the World Electronic Circuits Council (WECC). 3 Volunteers Honored for Contributions to IPC and Electronics Industry IPC—Association Con- necting Electronics Indus- tries presented Commit- tee Leadership, Special Recognition and Distin- guished Committee Ser- vice Awards on September 26 at IPC's Fall Standards Development Committee Meetings in Rosemont, Illinois. 4 From Automotive to IoT, electronica 2016 has a Supporting Program From November 8–11, 2016, the internation- al electronics industry will meet in Munich at the world's leading trade fair for electron- ic components, sys- tems and applications. Besides more than 2,800 international exhibitors, visitors can expect an extensive supporting pro- gram with four conferences and five forums. TOP TEN Recent Highlights from PCB007

Articles in this issue

Links on this page

Archives of this issue

view archives of PCB007 Magazine - PCB-Nov2016