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4 The PCB Design Magazine • November 2016 Time after time, we've heard about issues that contin- ue to challenge readers like you, and some of the most often cited problem areas are related to vias. Whether blind, buried, microvias, thermal vias, landless or back- drilled, vias are a big problem. In this issue, David Wolf of Conductor Analysis Technologies takes us through the company's analysis program and highlights some of the trends and problems areas he sees in via struc- tures. Mark Thompson of Prototron Circuits focuses on some typical via missteps and miscues he sees in the CAM department. Martyn Gaudion of Polar Instruments discusses vias, modelling and signal integrity. And David Warren of Sunstone Circuits takes us through the com- pany's move into the RF and microwave space. November 2016 Feature Content Vias CAT's David Wolf on Via Reliability Analysis Interview with David Wolf FEATURE COLUMNS Hey, They're Just Vias— or Are They? by Mark Thompson Vias, Modelling, and Signal Integrity by Martyn Gaudion 12 22 30 12 22 30

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