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December 2016 • The PCB Magazine 83 UNDERSTANDING PREDICTIVE ENGINEERING sizes and design rules can be used to create tech- nology files that drive modern CAD programs. Conclusion If companies want to reduce product gen- eration time to market, development costs and production costs, then DFM/A needs to be in- tegrated into a product generation framework. concurrent engineering, concurrent manufac- turing, product data management and predic- tive engineering all are essential elements. The tools, software and elements of such a vision are shown in Figure 9. All that remains is to find a software environment to add predictive engi- neering. PCB References 1. Hume, H., Komm, R., and Garrison, T., IBM. "Design Report Card: A Method for Mea- suring Design for Manufacturability," Surface Mount International Conference, Sept. 1992, pp. 986–991. 2. Holden, Happy, "DFM In PWB Fab: A Re- view of Predictive Engineering Benefits," Sur- face Mount International Conference, Sept. 1, 1993, pp. 877–881. 3. Holden, Happy, "Microvia PCBs: The Next Generation of Substrates and Packages," FUTURE CIRCUITS, Issue 1, Vol.1 pp. 71–76. 4. Sandborn, Peter, "A Software Tool for Technology Tradeoff Evaluation in Multichip Packaging," IEEE/CHMT's IEMT '91 Sympo- sium, pp. 337–340. 5. Mantay, M.K.; Range, L.A.; Schoenberg, L.N.; "Optimizing Autorouting Boosts PCB Manufacturability," Electronics Packaging and Production, June 1991, pp. 58–61. 6. Hawiszczak, Robert, "Integrating Design for Producibility into a CAE Design Environ- ment," NEPCON East, June 1989, pp. 3–14. 7. D.P. Seraphim, R.C. Lasky, and C.Y. Li, Principles of Electronic Packaging, McGraw-Hill Book Co., 1989, pp. 39–52. 8. Holden, Happy, "Segmentation of Assem- blies: A Way to Predict PWB Characteristics," IPC T/MRC meeting, New Orleans, Dec. 6, 1994. 9. Mangin, Charles-Henri, "Complexity Lev- els and Price Performance," Circuit Assembly, Feb. 1994, pp. 46–48. 10. Logan, Patric, "The Benefits of a Manu- facturing Software Framework", Surface Mount International Conference, Sept 1, 1993, pp 851– 855. 11. Davis, Ronald, "PDM caps the enterprise strategy," Manufacturing Systems, May, 1994, pp. 38–48. Happy Holden has worked in print- ed circuit technology since 1970 with Hewlett-Packard, NanYa/West- wood, Merix, Foxconn and Gen- tex. He is the co-editor, with Clyde Coombs, of the recently published Printed Circuit Handbook, 7th Ed. To contact Holden, click here. Following a decade of intensive research into graphene and two-dimen- sional materials, a new semiconductor material shows potential for the fu- ture of super-fast electron- ics. Indium Selenide (InSe) is only a few atoms thick, similarly to graphene, and reported in Nature Nanotechnology this week by researchers of The University of Manchester and their colleagues at The University of Notting- ham. The new research shows that InSe crystals can be only a few atoms thick, nearly as thin as gra- phene. InSe was shown to have electronic quality higher than silicon, which is ubiquitously used in modern electronics. New Ultra-Thin Semiconductor Could Extend Life of Moore's Law

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